Hendon Semiconductors Manufacturing
Hendon Semiconductors has manufactured microelectronic components and assemblies for over 20 years to automotive, telecommunication, appliance, medical and safety markets. The demands of these market segments are met through our highly skilled workforce and a modern ISO 9000-2000 accredited manufacturing plant.
Hendon Semiconductors has specialised experience in:
Integrated Circuit Fabrication (Bipolar Technology)
With 30 years of experience in integrated circuit foundry activity, Hendon Semiconductors’ leading capabilities include:
- fabless operation with outsourced wafer fabrication
- wide packaging options to world standards
- in-house slice probe testing
- in-house integrated circuit testing
- qualification and life testing
Hybrid Thick film on Ceramic Substrate
With more than 20 years experience in supplying to the high demands of the global auto industry, capabilities include:
- multi layer ceramic hybrid printing
- static and dynamic laser trim
- naked chip (die) attach and gold wire bonding
- robotic chip coating
- multiple pinning and conformal coating options
- in-house high-level automatic production and qualification testing
Surface Mount PCB Assembly Manufacturing
Surface mount and leaded component PCB assemblies for automotive, appliance and medical equipment manufacturers. This capability allows us to provide our customers with an enhanced product as a total solution. Capabilities include:
- auto component gluing
- automatic surface mounting
- reflow and wave soldering
- custom robotic assembly
- in-house high level automatic production and qualification testing
Module and Product Assembly
Hendon Semiconductors manufactures and supplies complete products and module assemblies to markets in which skilled assembly, testing, quality and reliability are critical.
Product Testing
Hendon Semiconductors comprehensively tests products from integrated circuits to complete electronic assemblies. This capability is based around the company’s expertise and experience in developing high-speed automatic (ATE) testers, complex test interface cards for probe testing of IC slices, packaged ICs, hybrids and modules.
